Nightfood Holdings Inc., doing business as TechForce Robotics, announced that its TechForce Advanced Manufacturing Inc. subsidiary expects to begin shipping wafer automated optical inspection equipment during the coming week, marking the start of commercial fulfillment following its October 2026 acquisition of related technology and intellectual property from Taiwan-based Jun Long Machine Industrial Co. Ltd.
The company is targeting fulfillment of approximately 80 equipment units by the end of the first calendar quarter of 2027, representing a potential revenue opportunity exceeding NT$280 million, or approximately $9 million. The estimate is subject to accepted purchase orders, successful fulfillment and applicable revenue recognition requirements.
To support production, TAMI plans to establish a wholly owned subsidiary in Taiwan and an approximately 20,000-square-foot manufacturing facility for equipment assembly, testing and supply chain operations. Management expects the subsidiary to be formed and the facility ready for initial occupancy within 30 days, subject to regulatory and operational requirements.
The expansion is intended to support semiconductor inspection applications associated with advanced packaging, artificial intelligence infrastructure and high-performance computing, while providing additional manufacturing capacity for potential future orders. For a detailed view of the announcement, the full press release is available at https://ibn.fm/qLKrr.
Nightfood Holdings, through its TechForce Robotics business, positions itself as an advanced robotics and automation company focused on delivering intelligent, scalable solutions for industrial and commercial applications. The company integrates robotics, artificial intelligence and software-driven systems to optimize operations, improve efficiency and enable next-generation automation. TechForce Advanced Manufacturing, a Nevada corporation, was formed to develop, manufacture, commercialize, install and support semiconductor automation and inspection systems. Its initial focus is expanding Wafer Sorter and AOI production for wafer-based semiconductor and CoWoS-related advanced-packaging applications, while pursuing future applications supporting emerging Chip-on-Panel-on-Substrate manufacturing processes.
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