SUSS MicroTec SE (MDAX/TecDAX: SMHN), a leading supplier of equipment and process solutions for the semiconductor industry, today announced its entry into the wafer-level cleaning market with the launch of the new GreenTec Solutions product line and the introduction of its first system, the GT200. The launch expands SUSS' technology portfolio into a market that today represents an addressable market of approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and increasing semiconductor demand from AI and high-performance computing applications.
"GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy," says Burkhardt Frick, Chief Executive Officer of SUSS. "By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio. Our differentiated approach combines strong cleaning performance, significantly lower chemical consumption and the elimination of hazardous acids and organic solvents."
At the core of the portfolio is a hybrid cleaning approach that combines the proven SUSS process technologies TurbulenStrip™ and CrustBuster™ from the Photomask Solutions segment in a single platform. TurbulenStrip™ incorporates lower-impact batch soaking and single-wafer handling for efficient resist and residue removal, while CrustBuster™ utilizes patented in-situ UV technology to break down and remove organic materials directly at the wafer surface in a single-wafer process chamber. Together, these technologies enable highly efficient residue removal and process stability while helping customers reduce chemical consumption, support their sustainability targets, and lower overall cost-of-ownership.
The GT200 is specifically designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, Power Device, and CMOS applications. In addition to equipment supply, SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization services to accelerate adoption, improve process stability, and de-risk technology transfers ahead of volume production ramps. More information about the GT200 is available at https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200.
Following SUSS’ strategic approach, all platforms of the GreenTec Solutions product line are designed with a focus on a high degree of modularization and standardization, with the GT200 serving as the first member of a scalable GreenTec platform. SUSS will expand its portfolio toward high-volume manufacturing (HVM) with a dedicated 300 mm HVM platform in 2027. "Due to the strong interest from our customers, we are pulling in the launch of a 300 mm HVM solution," explains Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. A 200 mm HVM platform will follow in 2028, providing customers with a clear migration path from evaluation to full-scale production.
The launch matters because it positions SUSS in a growing market with significant long-term potential, driven by advanced packaging and AI-related demand. By offering a sustainable cleaning solution that reduces chemical consumption and eliminates hazardous acids and organic solvents, SUSS addresses the semiconductor industry's increasing focus on environmental, social, and governance (ESG) goals. The GT200's hybrid concept consolidates multiple cleaning and stripping steps, reducing wafer transfers and toolset complexity, which can lead to shorter process learning cycles and lower environmental, health, and safety (EHS) exposure. This innovation could help semiconductor manufacturers lower costs and improve operational efficiency while meeting sustainability targets.
Meet SUSS at SEMICON West to discover the latest developments in wafer-level cleaning and join Product Deep Dives. Register now at https://www.suss.com/en/company/events/semicon-west. For more information, visit www.suss.com.
